[1] Lin Jiang, Anthony Dowling, Ming-C. Cheng, Yu Liu, “PODTherm-GP: A Physics-based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUs”, IEEE Tran Computers, Early Access 2023. DOI: 10.1109/TC.2023.3278535
[2] L. Jiang, Y. Liu and M. -C. Cheng, "Fast-Accurate Full-Chip Dynamic Thermal Simulation With Fine Resolution Enabled by a Learning Method," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 42, no. 8, pp. 2675-2688, Aug. 2023, doi: 10.1109/TCAD.2022.3229598.
[3] Alessandro Pulimeno, Graham Coates-Farley, Martin Veresko, Lin Jiang, Ming-Cheng Cheng, Yu Liu, Daqing Hou, “Physics-driven proper orthogonal decomposition: A simulation methodology for partial differential equations”, MethodsX, Vol. 10, May 2, 2023, 102204. https://doi.org/10.1016/j.mex.2023.102204
[4] Martin Veresko, Ming-Cheng Cheng, Physics-informed Reduced-Order Learning from the First Principles for Simulation of Quantum Nanostructures, Scientific Reports, vol. 13, April 16, 2023. https://doi.org/10.1038/s41598-023-33330-9.
[5] Martin Veresko, Ming-C. Cheng, “Quantum element method for multi-dimensional nanostructures enabled by a projection-based learning algorithm, Solid-State Electronics”, vol. 202, 108610, April, 2023. https://doi.org/10.1016/j.sse.2023.108610.
[6] Anthony Dowling, Lin Jiang, Ming-Cheng Cheng, Yu Liu, "TDF: A compact file format plugin for FEniCS," SoftwareX, Volume 22, 101329, Feb. 2023. https://doi.org/10.1016/j.softx.2023.101329.
[7] Ming-C. Cheng, "Quantum element method for quantum eigenvalue problems derived from projection-based model order reduction", AIP Advances, Vol. 10, 115305, 2020. doi: 10.1063/5.0018698.
[8] D.S. Meyer, B.T. Helenbrook, and Ming-C. Cheng, “Proper orthogonal decomposition-based reduced basis element thermal modeling of integrated circuits”, Int. J. Numer. Meth. Engng., 112, pp. 479-500, 2017
[9] Ming-C. Cheng, “A Reduced-Order Presentation of the Schrödinger Equation”, AIP Advances, vol.6, No. 9, 095121, Sept., 2016.
[10] Wangkun Jia, Brian Helenbrook, Ming-C. Cheng, “Fast Thermal Simulation of FinFET Circuits Based on a Multi-Block Reduced-Order Model”, IEEE Trans. CAD ICs & Systems, vol. 35, no. 7, pp. 1114-1124, July 2016.
[11] Wangkun Jia, Brian Helenbrook, Ming-C. Cheng, “Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition”, IEEE Trans. Electron Devices, Vol. 61, No. 8, pp. 2752-2759, August, 2014.
[1] Lin Jiang, Anthony Dowling, Yu Liu, Ming-C. Cheng, “Ensemble Learning Model for Effective Thermal Simulation of Multi-core CPUs”, submitted to Integration, the VLSI journal.
[1] Martin Veresko, Yu Liu, Daqing Hou, Ming-Cheng Cheng, “Quantum Element Simulations for Periodic Nanostructures”, prepared for publication.
[2] Lin, Jiang, Yu Liu and Ming-Cheng Cheng, Effective Local Learning Model for Chip-level Thermal Simulation of Large-scale Microprocessors, prepared for publication.
[1] Martin Veresko, Ming-C. Cheng, "Schrödinger Equation Solver Based on Data-Driven Physics- Informed Generic Building Blocks", Int. Workshop for Computational Nanotechnology (IWCN 2023), Barcelona, Spain, June 12-16, 2023.
[2] Ming-C. Cheng and Wangkun Jia, "Multi-Element Thermal Modeling of Interconnects Derived from a Projection-based Leaning Algorithm," 2021 Int. Conf. Simulation of Semicond. Processes and Devices (SISPAD), 2021, pp. 73-76, doi: 10.1109/SISPAD54002.2021.9592588.
[3] Martin Veresko and Ming-C. Cheng, "An Effective Simulation Methodology of Quantum Nanostructures based on Model Order Reduction," 2021 Int. Conf. Simulation of Semiconductor Processes and Devices (SISPAD), 2021, pp. 64-68, doi: 10.1109/SISPAD54002.2021.9592599.
[4] Lin Jiang, Yu Liu, Ming-C. Cheng, “An Effective and Accurate Data-Driven Approach for Thermal Simulation of CPUs”, 2021 InterSociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2021), 1008-1015, Virtual, June 1-4, 2021. doi: 10.1109/ITherm51669.2021.9503183.
[5] Ming-C. Cheng, "A Quantum Element Reduced Order Model," 2019 International Conf. Simulation of Semiconductor Processes and Devices (SISPAD), pp. 1-4, Udine, Italy, Sept 4-6, 2019, doi: 10.1109/SISPAD.2019.8870453.
[6] Lin Jiang, Anthony Dowling, Yu Liu, Ming-Cheng Cheng, “Exploring and Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs”, accepted by IEEE International Symposium on Circuits and Systems (ISCAS) 2022, Austin, Texas, USA, 2022.5. (Winning the ITherm 2022 Prof. Avram Bar-Cohen Best Paper Award)
[7] Lin Jiang, Anthony Dowling, Yu Liu, Ming-Cheng Cheng, “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition”, accepted by 2022 IEEE ITherm Conference, San Diego, CA, USA, 2022.5.
[8] Lin Jiang, Martin Veresko, Yu Liu, Ming-Cheng Cheng, “An Effective Physics Simulation Methodology Based on a Data-Driven Learning Algorithm”, accepted by ACM Platform for Advanced Scientific Computing Conference (PASC) 2022, Basel, Switzerland, 2022.6.
[1] Lin Jiang, Yu Liu, Ming-C. Cheng, “Predicting Hot Spots in a Ten-Thousand-Core GPU with a 5-Order Speedup over FEM Enabled by a Physics-based Learning Algorithm”, 2024 InterSociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2024), May 28-May 31, 2024.